New details about the future flagship of Sony

Insiders merged the network characteristics of the upcoming flagship smartphones Sony. Earlier it became known that the Japanese manufacturer succumbed to new trends and is going to equip models with dual cameras and a display with thin frames. Also, numerous leaks confirmed the presence of the latest 8-core processor Snapdragon 845. This time there were details about Sony H8216 and H8266, as well as tests of the performance of the flagship chip Qualcomm.

According to new data, Sony H8216 / H8266 will receive the following features:

  • Display: 5.48 inches, Full HD, Gorilla Glass 5;
  • processor: Snapdragon 845;
  • RAM: 4/6 GB;
  • Drive: 64/128 GB;
  • Battery: 3210/3240 mAh;
  • protection against water: IP65 / IP68;
  • Dimensions: 157 x 78 x 8.1 mm;
  • weight: 159 g;
  • OS: Android 8.1 Oreo.

 

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Also appeared the results of testing a Sony smartphone based on the Snapdragon 845 processor in the benchmark Geekbench. When evaluating performance in 3D rendering and processing with intensive calculation of RenderScript, the device scored 13,948 points. This test primarily demonstrates the capabilities of the graphics accelerator.

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For comparison, Snapdragon 835 types in the same test 7 899 points. Thus, the performance of the Adreno 630 is 76.58% higher than the Adreno 540.

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Judging by the number of leaks, Sony can introduce new smartphones already at CES 2018.



Source: gizchina.com

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